Temperature cycle testing of electronic components
Assuming an environment where the temperature changes repeatedly, we apply thermal stress due to temperature changes to confirm resistance!
We would like to introduce our "Temperature Cycle Test for Electronic Components." Electronic components are made up of various materials with different coefficients of thermal expansion. As a result, stress can occur due to these differences in thermal expansion coefficients, which may lead to defects. This test involves placing the test samples in an environment that alternates between specified low and high temperatures, applying stress over a specified number of cycles as part of the environmental testing. 【Applicable Standards】 ■ JIS C60068-2-14 (IEC 60068-2-14) ■ JEITA EIAJ ED-4701/100A ■ JEDEC JESD22-A104 ■ MIL-STD-883 METHOD 1010 *For more details, please download the PDF or feel free to contact us.
- Company：東芝ナノアナリシス
- Price：Other
